Microsystems Technology

Description

  • The 65 m2 small cleanroom at the Munich University of Applied Sciences is equipped with laminar flow boxes (cleanroom class 10 - 100 at the workplace) and air treatment via ceiling inlets. Access is via a lock

  • In the microsystem technology laboratory there are various commercial plants for the processing of wafers (Si, GaAs, lithium niobate, etc.) in the formats 4'' = 100 mm diameter up to partly 8'' = 200 mm diameter. Many typical semiconductor processes are possible, such as:
    • Photolithography (contact, one-sided, on both sides, up to approx. 1 micron)
    • Laser lithography (up to 0.7 micron structures)
    • Etching technology (wet incl. KOH dry: barrel, parallel plates and RIE)
    • Oxidation (moist and dry up to 8'') and diffusion (coming soon)
    • CVD (up to 6'') by TEOS, Poly-Si
    • Steaming (Al, Cu, Au, Cr, Ni),

  • Various measuring techniques are possible:
    • Ellipsometer, Spektralellipsometer
    • Reflektometrie
    • Microscopy with line width measurement
    • Confocal microscopy
    • White-light interferometry
    • Profilometer

  • Printed electronics:
    • Material printer for insulating, semiconducting and conductive inks from FujiDimatix
    • System for photonic sintering of NovaCentrix

  • Other:
    • Design
    • Polishing of 4''-Wafern
    • Sawing and cracking of wafers
    • Inkjet printing of electronic structures

  • Measuring station extension for characterizing data storage cells
  • Printing resistive data memory cells
  • Characterization of resistive data storage based on porous silicon
  • Printing sensors

Laboratory management

Prof. Dr. Christina Schindler Room: D 312

T +49 89 1265-1639
F +49 89 1265-1603

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Lab support

Michael Kaiser Room: D 207/206

T +49 89 1265-4554
F +49 89 1265-1603

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